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RoHS

RoHS Solderability Testing Services
            



JESD22-B102E

This test method provides optional conditions for preconditioning and soldering for the purpose of assessing the solderability of device package terminations. It provides procedures for dip & look solderability testing of through hole, axial and surface mount devices and a surface mount process simulation test for surface mount packages. The purpose of this test method is to provide a means of determining the solderability of device package terminations that are intended to be joined to another surface using lead (Pb) containing or Pb-free solder for the attachment.

Applicable Specifications & Standards:

JEDEC JESD22-B102

MIL-STD-883 Method-2003
Solderability

MIL-STD-750 Method-2026
Solderability

MIL-STD-202 Method-208
Solderability

 

All Component testing is performed under strict compliant Guidelines in ISO 9001:2008 

 

 



GHG ELECTRONIC SERVICES
49 Baxter Street
Medford, MA. 02155
Phone: 781-391-1147
Fax: 781-395-7687

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